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Prof. Dr.-Ing. Ute Geißler

Fachbereich Ingenieur- und Naturwissenschaften

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List of publications of Prof. Dr.-Ing. Ute Geißler (45)

2021 | Journal article | published
Fabrication of an antireflection microstructure on AgClBr polycrystalline fiber by single pulse femtosecond laser ablation
Mikhail K. Tarabrin, Andrey A. Bushunov, Andrei A. Teslenko, Tatiana Sakharova, Jonas Hinkel, Iskander Usenov, Torsten Döhler, Ute Geißler, Viacheslav Artyushenko, Vladimir A. Lazarev (2021)
Optical Materials Express. 11 (Issue 2), 487-496.
THpub | DOI
2020 | Conference contribution | published
Study of the Wrinkle Formation in the Heel Zone of Heavy Wire Bonds
Torsten Döhler, Ute Geißler, von Ribbeck Hans-Georg, Fabian Fidorra, Florens Felke (2020)
2020 43rd International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). : IEEE
THpub | DOI
2020 | Conference contribution | published
Loop formation effects on the lifetime of wire bonds for power electronics
Hans-Georg von Ribbeck, Torsten Döhler, Bernhard Czerny, Golta Khatibi, Ute Geißler (2020)
CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG (pp. 467-472). : VDE VERLAG GMBH Berlin Offenbach
THpub
2019 | Conference contribution | published
Entwicklung einer Scherkraftmessung zur qualitativen Analyse und Optimierung von Wafer Bonding Prozessen
Patrick Krüger, Matthias Wietstruck, Gudrun Kissinger, Marco Lisker, Andreas Krüger, Torsten Döhler, Jan Schäffner, Heike Silz, Ute Geißler, Mehmet Kaynak (2019)
MikroSystemTechnik Kongress 2019 : Mikroelektronik | MEMS-MOEMS | Systemintegration - Säulen der Digitalisierung und künstlichen Intelligenz : proceedings 28.-30. Oktober 2019 in Berlin (pp. 722-725). : VDE VERLAG GMBH · Berlin · Offenbach
THpub
2017 | Journal article | published
Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Ute Geißler, Martin Schneider-Ramelow (2017)
PLUS : Produktion von Leiterplatten und Systemen. 2017 (1), 92-94.
THpub
2016 | Conference contribution | published
Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling
Christian Ehrhardt, Ute Geißler, Jan Höfer (2016)
CIPS 2016 : 9th International Conference on Integrated Power Electronics Systems : proceedings (pp. k.A.). Berlin ; Offenbach: VDE Verlag GmbH
THpub
2016 | Journal article | published
Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Ute Geißler, Biswajit Mukhopadhyay, Janine Stockmeyer (2016)
PLUS : Produktion von Leiterplatten und Systemen. 11, 2225-2231.
THpub
2016 | Journal article | published
Aluminum-Scandium: A Material for Semiconductor Packaging
Ute Geißler, Sven Thomas, Martin Schneider-Ramelow, Biswajit Mukhopadhyay, Klaus-Dieter Lang (2016)
Journal of Electronic Materials. 45 (10), 5456–5467.
THpub | DOI
2015 | Journal article | published
Microstructural Evolution of Ultrasonic Bonded Aluminum Wires
Marian Broll, Ute Geißler, Jan Höfer (2015)
Microelectronics Reliability. 55 (6), 961-968.
THpub | DOI
2015 | Journal article | published
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Marian Broll, Ute Geißler, Martin Schneider-Ramelow (2015)
Microelectronics Reliability. 55 (9-10), 1855-1860.
THpub | DOI
2013 | Conference contribution | published
A new Aluminium Alloy for Heavy Wire Bonding in Power Electronics-First Tests of Bonding Behaviour and Reliability
Ute Geißler, Jens Göhre, Sven Thomas, Martin Schneider-Ramelow, Klaus-Dieter Lang (2013)
PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013 ; proceedings (pp. k.A.).
THpub
2013 | Conference contribution | published
Drahtbondtechnologie 2013 - Trends und Innovationen
Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz, Klaus-Dieter Lang (2013)
Erfolgreiches Qualifying für die erste Startreihe : Konferenzband zur 21. FED-Konferenz "Elektronik-Design, Leiterplatten, Baugruppen 2013" (pp. 349-368). Berlin: FED
THpub
2013 | Journal article | published
Development and Status of Cu Ball/Wedge Bonding in 2012
Martin Schneider-Ramelow, Ute Geißler (2013)
Journal of Electronic Materials (JEM). 42, 558-595.
THpub | DOI
2012 | Conference contribution | published
Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Ute Geißler, Eugen Milke, Martin Schneider-Ramelow (2012)
Elektronische Baugruppen und Leiterplatten : hochentwickelte Baugruppen aus Europa (pp. 227-232). Berlin: VDE-Verl.
THpub
2012 | Book chapter/section | published
Neue Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Ute Geißler, Martin Schneider-Ramelow, Eugen Milke (2012)
In Jahrbuch Mikroverbindungstechnik. (pp. 100-111). Düsseldorf: DVS Media-Verlag.
THpub
2012 | Conference contribution | published
Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors
Jens Göhre, Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang (2012)
Proceedings / CIPS 2012 (pp. k.A.). Berlin ; Offenbach: VDE-Verl.
THpub | URL
2012 | Journal article | published
Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Mohamad Sbeiti, Wolfgang, H. Müller, Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz (2012)
Proceedings in Applied Mathematics and Mechanics (PAMM). 12 (1), 369-370.
THpub | DOI
2011 | Journal article | published
Temperatur und Interdiffusion beim Ultraschall-Wedge/Wedge-Bondverschweißen von Aluminiumdrähten auf Ni/Flash-Au
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow (2011)
PLUS : Produktion von Leiterplatten und Systemen. 1, 145-150.
THpub
2011 | Journal article | published
Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang, H. Müller, Herbert Reichl (2011)
Journal of Electronic Materials. 40 (2), 239-246.
THpub | DOI
2011 | Conference contribution | published
Optimierung der Drahteigenschaften für verbesserte Aluminium-Bondkontakte
Ute Geißler, Eugen Milke, Martin Schneider-Ramelow (2011)
Deutsche IMAPS-Konferenz, München (pp. k.A.).
THpub
2011 | Conference contribution | published
Thermo-mechanical description of material diffusion during an ultrasonic wire bonding process
Wolfgang, H. Müller, Mohamad Sbeiti, Martin Schneider-Ramelow, Ute Geißler (2011)
Proceedings in Applied Mathematics and Mechanics (PAMM) : 82nd Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM), Graz 2011 (pp. 427-428).
THpub | DOI
2011 | Journal article | published
Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Teil 2
Martin Schneider-Ramelow, Ute Geißler (2011)
PLUS : Produktion von Leiterplatten und Systemen. 9, 2092-2111.
THpub
2011 | Journal article | published
Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Teil 1
Martin Schneider-Ramelow, Ute Geißler (2011)
PLUS : Produktion von Leiterplatten und Systemen. 11, 1852-1871.
THpub
2010 | Book chapter/section | published
Wire Bonding as Dynamic Process of Hardening and Softening
Ute Geißler, Martin Schneider-Ramelow (2010)
In Bernd Michel, Klaus-Dieter Lang, Smart systems integration and reliability. (pp. 422-433). Dresden: Goldenbogen.
THpub
2010 | Journal article | published
Degradation of Heavy Wire Bond Interfaces : Tested on Power Semiconductors during Active Power Cycling
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
Bodo´s Power Systems. 6, 34-36.
THpub | URL
2010 | Conference contribution | published
Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
Proceedings / PCIM Europe 2010 : International Exhibition & Conference for Power Electronics Intelligent Motion Power Quality (pp. k.A.). Berlin ; Offenbach: VDE-Verl.
THpub
2010 | Conference contribution | published
Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
CIPS 2010 : 6th International Conference on Integrated Power Electronics Systems (pp. 97-102).
THpub | URL
2010 | Conference contribution | published
Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts
Wolfgang, H. Müller, Mohamad Sbeiti, Martin Schneider-Ramelow, Ute Geißler (2010)
2010 12th Electronics Packaging Technology Conference (pp. 473-478).
THpub | URL
2009 | Conference contribution | published
Strukturanalyse mit EBSD in der Mikrosystemtechnik
Ellen Auerswald, Ute Geißler, Bernd Michel (2009)
15. Tagung Festkörperanalytik Chemnitz (pp. k.A.).
THpub
2009 | Conference contribution | published
Mikrostrukturelle Vorgänge der Verschweißung von AlSi1-Draht im Ultraschall-Wedge/Wedge-Bondverfahren
Ute Geißler, Martin Schneider-Ramelow (2009)
Proceedings / Mikrosystemtechnik-Kongress 2009 (pp. P 8.13). Berlin: VDE-Verlag
THpub
2009 | Journal article | published
Mikrostrukturelle Vorgänge bei der Verschweißung von AlSi1-Draht im Wedge/Wedge-Bondprozess. Teil II
Ute Geißler (2009)
PLUS : Produktion von Leiterplatten und Systemen. 11 (4), 883-890.
THpub
2009 | Journal article | published
Mikrostrukturelle Vorgänge bei der Verschweißung von AlSi1-Draht im Wedge/Wedge-Bondprozess. Teil I
Ute Geißler (2009)
PLUS : Produktion von Leiterplatten und Systemen. 11 (3), 605-619.
THpub
2009 | Book chapter/section | published
Verbindungsbildung beim Bonden von Aluminium-Draht
Ute Geißler, Martin Schneider-Ramelow (2009)
In Jahrbuch Mikroverbindungstechnik. (pp. 51-65). Düsseldorf: DVS Media-Verlag.
THpub
2009 | Journal article | published
Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding
Ute Geißler, Martin Schneider-Ramelow, Herbert Reichl (2009)
IEEE Transaction on Components and Packaging Technologies. 32, 794-799.
THpub | DOI
2009 | Journal article | published
Analyse des Rissverlaufs in Dickdrahtbondverbindungen auf Leistungshalbleitern beim Active Power Cycling
Jens Göhre, Ute Geißler, Stefan Schmitz, Martin Schneider-Ramelow (2009)
PLUS. 11 (8), 1805-1809.
THpub
2008 | Thesis | published
Verbindungsbildung und Gefügeentwicklung beim Ultraschall-Wedge-Wedge-Bonden von AlSi1-Draht
Ute Geißler (2008)
(PhD, TU Berlin, 2008).
THpub | DOI | OPUS
2007 | Conference contribution | published
Micro-Nanomaterial Investigations of AlSi1 Bondcontacts
Ute Geißler, Martin Schneider-Ramelow, Herbert Reichl, Bernd Michel (2007)
In Bernd Michel, MicroNanoReliability 2007 (pp. 77). Dresden: Goldenbogen Verlag
THpub
2007 | Conference contribution | published
Interface Reactions during Au-Ball/Wedge and AlSi1-Wedge/Wedge Bonding at room temperature
Martin Schneider-Ramelow, Klaus-Dieter Lang, Ute Geißler, Wolfgang Scheel, Herbert Reichl (2007)
In 16th European Microelectronics and Packaging Conference and Exhibition 2007, 16th European Microelectronics and Packaging Conference and Exhibition 2007 (pp. 128-133). : EMPC 2007
THpub
2006 | Journal article | published
FIB preparation and TEM Analytics on AlSi1 Bond Pads
Ute Geißler, Hans-Jürgen Engelmann, Ingrid Urban, Herbert Reichl (2006)
Practical Metallography. 43 (10), 520-532.
THpub | DOI
2006 | Journal article | published
Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires
Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl (2006)
Journal of Electronic Materials. 35 (1), 173-180.
THpub | URL
2005 | Journal article | published
Grenzflächenuntersuchungen beim US-Wedge/Wedge-Bonden von Al-Drähten verschiedener Drahtstärken
Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl (2005)
PLUS : Produktion von Leiterplatten und Systemen. 12, 2257-2260.
THpub
2004 | Conference contribution | published
Metallkundliche Phänomene und Grenzflächenreaktionen beim US-Bonden von 25 µm AlSi1-Draht
Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl (2004)
In VDE-Verl., Aufbau-und Fertigungstechnik : die Trends von heute - die Chancen von morgen ; Vorträge der DVS/GMM-Fachtagung vom 4. bis 5. Februar 2004 in Fellbach (pp. 399-404). Berlin
THpub
2004 | Journal article | published
Grenzflächenuntersuchungen beim Ultraschall-Wedge-Wedgebonden von 25-µm-AlSi1-Draht
Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl (2004)
PLUS : Produktion von Leiterplatten und Systemen. 4, 636.
THpub
1996 | Journal article | published
Investigation of the transition range in seeded vapour grown ZnSe crystals
Ute Geißler, Herbert Hartmann, E. Krause, Dietmar Siche (1996)
Journal of Crystal Growth. 159 (1), 175-180.
THpub | DOI
1992 | Journal article | published
Characterization of extended defects in highly Te-doped GaSb single crystals grown by the Czochralski technique
Jürgen Doerschel, Ute Geißler (1992)
Journal of Crystal Growth. 121 (4), 781-789.
THpub | DOI