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List of publications of Fursenko, Oksana (7)

2019 | Journal article | published
Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process
Joachim Max Bauer, Oksana Fursenko, S. Marschmeyer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Christoph Zesch, Sigurd K. Schrader (2019)
Journal of Vacuum Science and Technology B. 37 (6), 062205.
THpub | DOI
2019 | Journal article | published
Diagnostic of graphene on Ge(100)/Si(100) in a 200 mm wafer Si technology environment by spectroscopic ellipsometry/reflectometry
Oksana Fursenko, Mindaugas Lukosius, Joachim Max Bauer, Claus Villringer, Helge Lux, Florian Bärwolf, Marco Lisker, Andreas Mai (2019)
Journal of Vacuum Science and Technology B. 37 (6), 062927.
THpub | DOI
2017 | Conference contribution | published
Very high aspect ratio through silicon via reflectometry
Joachim Max Bauer, Friedhelm Heinrich, Oksana Fursenko, Marschmeyer Steffen, Adrian Blümich, Silvio Pulwer, Patrick Steglich, Claus Villringer, Andreas Mai, Sigurd K. Schrader (2017)
Proceedings of SPIE : Optical Measurement Systems for Industrial Inspection X (pp. 103293J).
THpub | DOI
2017 | Conference contribution | published
Development of graphene process control by industrial optical spectroscopy setup
Oksana Fursenko, Mindaugas Lukosius, Grzegorz Lupina, Joachim Max Bauer, Claus Villringer, Andreas Mai (2017)
Proceedings of SPIE : Modeling Aspects in Optical Metrology VI (pp. 1033017).
THpub | DOI
2016 | Conference contribution | published
3D through silicon via profile metrology based on spectroscopic reflectometry for SOI applications
Oksana Fursenko, Joachim Max Bauer, S. Marschmeyer (2016)
Proceedings of SPIE : Optical Micro- and Nanometrology VI (pp. k.A.).
THpub | DOI
2015 | Journal article | published
Through silicon via profile metrology of Bosch etching process based on spectroscopic reflectometry
Oksana Fursenko, Joachim Max Bauer, S. Marschmeyer, H.-P. Stoll (2015)
Microelectronic Engineering. 139, 70-75.
THpub | DOI
2014 | Journal article | published
In-line through silicon vias etching depths inspection by spectroscopic reflectometry
Oksana Fursenko, Joachim Max Bauer, S. Marschmeyer (2014)
Microelectronic Engineering. 122, 25-28.
THpub | DOI