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Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

Title:
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Year:
2015
Publication type:
Journal article
Journal:
Microelectronics Reliability
ISSN:
0026-2714
Number:
9-10
Volume:
55
Pages:
1855-1860
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2172
Broll, M., Geißler, U., & Schneider-Ramelow, M. (2015). Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding Microelectronics Reliability. 55 (9-10), 1855-1860.
@article{2172,
    author           = {Broll, Marian and Geißler, Ute and Schneider-Ramelow, Martin},
    title            = {Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding},
    journal          = {Microelectronics Reliability},
    year             = {2015},
    volume           = {55},
    number           = {9-10},
    pages            = {1855-1860},
    doi              = {http://dx.doi.org/10.1016/j.microrel.2015.06.061},
}


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