Development and Status of Cu Ball/Wedge Bonding in 2012
Title:
Development and Status of Cu Ball/Wedge Bonding in 2012
Authors:
Year:
2013
Publication type:
Journal article
Journal:
Journal of Electronic Materials (JEM)
ISSN:
0361-5235
Volume:
42
Pages:
558-595
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2175
Schneider-Ramelow, M., & Geißler, U. (2013). Development and Status of Cu Ball/Wedge Bonding in 2012 Journal of Electronic Materials (JEM). 42, 558-595.
@article{2175,
author = {Schneider-Ramelow, Martin and Geißler, Ute},
title = {Development and Status of Cu Ball/Wedge Bonding in 2012},
journal = {Journal of Electronic Materials (JEM)},
year = {2013},
volume = {42},
pages = {558-595},
doi = {10.1007/s11664-012-2383-0},
}