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Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts

Title:
Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts
Abstract:
Interface formation between 25-μm AlSi1 wire and flash-Au substrate metallization during a bonding time of 50 ms has been investigated. Only a few milliseconds after the ultrasonic power is switched on, intermetallic phase growth starts, continuing until the end of the wire-bonding process. During the entire bonding time, the fraction of the interface covered with Au8Al3 increases, and at the end of the bonding time, the interface is nearly completely covered with that phase. Finite-element modeling (FEM) of the temperature in the interface region indicates maximum temperatures well below 100°C, thus making solely thermally activated intermetallic phase growth impossible. However, it is demonstrated that the phase growth observed during the ultrasonic wire-bonding process could result from an accelerated diffusion process caused by a higher vacancy concentration. The accelerated diffusion process would have an activation energy Q of 0.36 eV.
Year:
2011
Publication type:
Journal article
Journal:
Journal of Electronic Materials
ISSN:
0361-5235
Number:
2
Volume:
40
Pages:
239-246
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2181
Geißler, U., Funck, J., Schneider-Ramelow, M., Engelmann, H., Rooch, I., Müller, W., et al. (2011). Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts Journal of Electronic Materials. 40 (2), 239-246.
@article{2181,
    author           = {Geißler, Ute and Funck, Jürgen and Schneider-Ramelow, Martin and Engelmann, Hans-Jürgen and Rooch, Ingrid and Müller, Wolfgang, H. and Reichl, Herbert},
    title            = {Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts},
    journal          = {Journal of Electronic Materials},
    year             = {2011},
    volume           = {40},
    number           = {2},
    pages            = {239-246},
    doi              = {10.1007/s11664-010-1439-2},
}


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