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Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires

Title:
Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires
Year:
2006
Publication type:
Journal article
Journal:
Journal of Electronic Materials
ISSN:
0361-5235
Number:
1
Volume:
35
Pages:
173-180
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2191
Geißler, U., Schneider-Ramelow, M., Lang, K., & Reichl, H. (2006). Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires Journal of Electronic Materials. 35 (1), 173-180.
@article{2191,
    author           = {Geißler, Ute and Schneider-Ramelow, Martin and Lang, Klaus-Dieter and Reichl, Herbert},
    title            = {Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires},
    journal          = {Journal of Electronic Materials},
    year             = {2006},
    volume           = {35},
    number           = {1},
    pages            = {173-180},
    url              = {https://link.springer.com/article/10.1007/s11664-006-0201-2},
}


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