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Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts

Title:
Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts
Year:
2010
Publication type:
Conference contribution
Conference:
12th Electronics Packaging Technology Conference (EPTC)
Book title:
2010 12th Electronics Packaging Technology Conference
Pages:
473-478
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2199
Müller, W., Sbeiti, M., Schneider-Ramelow, M., & Geißler, U. (2010). Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts 2010 12th Electronics Packaging Technology Conference (pp. 473-478). .
@inproceedings{2199,
    author           = {Müller, Wolfgang, H. and Sbeiti, Mohamad and Schneider-Ramelow, Martin and Geißler, Ute},
    title            = {Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts},
    year             = {2010},
    pages            = {473-478},
    booktitle        = {2010 12th Electronics Packaging Technology Conference},
    url              = {http://ieeexplore.ieee.org/document/5702686/},
}


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