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Loop formation effects on the lifetime of wire bonds for power electronics

Title:
Loop formation effects on the lifetime of wire bonds for power electronics
Abstract:
In the present work, the influence of loop forming aspects on the reliability of US-bonded aluminium heavy wires was studied, combining three measurement techniques, for the first time: Laser confocal microscopy based wrinkling characterization, accelerated lifetime measurements BAMFIT and destructive pull tests. The focus of this study was the systematic investigation of the heel region of the wire bond depending on process parameters and especially on the loop geometry regarding durability and lifetime. As first results, effects reducing durability were identified which are not apparent in normal testing and a recommendation for the use of reverse movements can be given.
Year:
2020
Publication type:
Conference contribution
Conference:
CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG
Book title:
CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG
ISBN:
978-3-8007-5225-6
Pages:
467-472
Language:
English
Document status:
Published
PubListerURL:
https://publister.bib.th-wildau.de/publister/public/publication/2836
von Ribbeck, H., Döhler, T., Czerny, B., Khatibi, G., & Geißler, U. (2020). Loop formation effects on the lifetime of wire bonds for power electronics CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG (pp. 467-472). : VDE VERLAG GMBH Berlin Offenbach.
@inproceedings{2836,
    author           = {von Ribbeck, Hans-Georg and Döhler, Torsten and Czerny, Bernhard and Khatibi, Golta and Geißler, Ute},
    title            = {Loop formation effects on the lifetime of wire bonds for power electronics},
    year             = {2020},
    month            = {March},
    pages            = {467-472},
    publisher        = {VDE VERLAG GMBH Berlin Offenbach},
    isbn             = {978-3-8007-5225-6},
    booktitle        = {CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG},
}


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