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2017 | Journal article | published
Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Ute Geißler, Martin Schneider-Ramelow (2017)
PLUS : Produktion von Leiterplatten und Systemen. 2017 (1), 92-94.
THpub
2016 | Conference contribution | published
Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling
Christian Ehrhardt, Ute Geißler, Jan Höfer (2016)
9th International Conference of Integrated Power Electronic Systems, Berlin ; Offenbach.
THpub
2016 | Journal article | published
Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Ute Geißler, Biswajit Mukhopadhyay, Janine Stockmeyer (2016)
PLUS : Produktion von Leiterplatten und Systemen. 11, 2225-2231.
THpub
2016 | Journal article | published
Aluminum-Scandium: A Material for Semiconductor Packaging
Ute Geißler, Sven Thomas, Martin Schneider-Ramelow, Biswajit Mukhopadhyay, Klaus-Dieter Lang (2016)
Journal of Electronic Materials. 45 (10), 5456–5467.
THpub | DOI
2015 | Journal article | published
Microstructural Evolution of Ultrasonic Bonded Aluminum Wires
Marian Broll, Ute Geißler, Jan Höfer (2015)
Microelectronics Reliability. 55 (6), 961-968.
THpub | DOI
2015 | Journal article | published
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Marian Broll, Ute Geißler, Martin Schneider-Ramelow (2015)
Microelectronics Reliability. 55 (9-10), 1855-1860.
THpub | DOI
2013 | Book chapter/section | published
Neue Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Ute Geißler, Martin Schneider-Ramelow, Eugen Milke (2013)
In Jahrbuch Mikroverbindungstechnik. (pp. 100-111). Düsseldorf: DVS Media-Verlag.
THpub
2013 | Conference contribution | published
A new Aluminium Alloy for Heavy Wire Bonding in Power Electronics-First Tests of Bonding Behaviour and Reliability
Ute Geißler, Jens Göhre, Sven Thomas, Martin Schneider-Ramelow, Klaus-Dieter Lang (2013)
PCIM-Konferenz Power Electronics.
THpub
2013 | Conference contribution | published
Drahtbondtechnologie 2013 - Trends und Innovationen
Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz, Klaus-Dieter Lang (2013)
Erfolgreiches Qualifying für die erste Startreihe : Konferenzband zur 21. FED-Konferenz "Elektronik-Design, Leiterplatten, Baugruppen 2013" (pp. 349-368). Berlin: FED
THpub
2013 | Journal article | published
Development and Status of Cu Ball/Wedge Bonding in 2012
Martin Schneider-Ramelow, Ute Geißler (2013)
Journal of Electronic Materials (JEM). 42, 558-595.
THpub | DOI
2012 | Conference contribution | published
Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Ute Geißler, Eugen Milke, Martin Schneider-Ramelow (2012)
EBL - Elektronische Baugruppen und Leiterplatten, Berlin, 227-232.
THpub
2012 | Conference contribution | published
Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors
Jens Göhre, Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang (2012)
CIPS 2012, Berlin ; Offenbach.
THpub | URL
2012 | Journal article | published
Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Mohamad Sbeiti, Wolfgang, H. Müller, Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz (2012)
Proceedings in Applied Mathematics and Mechanics (PAMM). 12 (1), 369-370.
THpub | DOI
2011 | Journal article | published
Temperatur und Interdiffusion beim Ultraschall-Wedge/Wedge-Bondverschweißen von Aluminiumdrähten auf Ni/Flash-Au
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow (2011)
PLUS : Produktion von Leiterplatten und Systemen. 1, 145-150.
THpub
2011 | Journal article | published
Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang, H. Müller, Herbert Reichl (2011)
Journal of Electronic Materials. 40 (2), 239-246.
THpub | DOI
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