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List of Publications (45)

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2021 | Journal article | published
Fabrication of an antireflection microstructure on AgClBr polycrystalline fiber by single pulse femtosecond laser ablation
Mikhail K. Tarabrin, Andrey A. Bushunov, Andrei A. Teslenko, Tatiana Sakharova, Jonas Hinkel, Iskander Usenov, Torsten Döhler, Ute Geißler, Viacheslav Artyushenko, Vladimir A. Lazarev (2021)
Optical Materials Express. 11 (Issue 2), 487-496.
THpub | DOI
2020 | Conference contribution | published
Study of the Wrinkle Formation in the Heel Zone of Heavy Wire Bonds
Torsten Döhler, Ute Geißler, von Ribbeck Hans-Georg, Fabian Fidorra, Florens Felke (2020)
2020 43rd International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). : IEEE
THpub | DOI
2020 | Conference contribution | published
Loop formation effects on the lifetime of wire bonds for power electronics
Hans-Georg von Ribbeck, Torsten Döhler, Bernhard Czerny, Golta Khatibi, Ute Geißler (2020)
CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG (pp. 467-472). : VDE VERLAG GMBH Berlin Offenbach
THpub
2016 | Conference contribution | published
Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling
Christian Ehrhardt, Ute Geißler, Jan Höfer (2016)
CIPS 2016 : 9th International Conference on Integrated Power Electronics Systems : proceedings (pp. k.A.). Berlin ; Offenbach: VDE Verlag GmbH
THpub
2016 | Journal article | published
Aluminum-Scandium: A Material for Semiconductor Packaging
Ute Geißler, Sven Thomas, Martin Schneider-Ramelow, Biswajit Mukhopadhyay, Klaus-Dieter Lang (2016)
Journal of Electronic Materials. 45 (10), 5456–5467.
THpub | DOI
2015 | Journal article | published
Microstructural Evolution of Ultrasonic Bonded Aluminum Wires
Marian Broll, Ute Geißler, Jan Höfer (2015)
Microelectronics Reliability. 55 (6), 961-968.
THpub | DOI
2015 | Journal article | published
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Marian Broll, Ute Geißler, Martin Schneider-Ramelow (2015)
Microelectronics Reliability. 55 (9-10), 1855-1860.
THpub | DOI
2013 | Conference contribution | published
A new Aluminium Alloy for Heavy Wire Bonding in Power Electronics-First Tests of Bonding Behaviour and Reliability
Ute Geißler, Jens Göhre, Sven Thomas, Martin Schneider-Ramelow, Klaus-Dieter Lang (2013)
PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013 ; proceedings (pp. k.A.).
THpub
2013 | Journal article | published
Development and Status of Cu Ball/Wedge Bonding in 2012
Martin Schneider-Ramelow, Ute Geißler (2013)
Journal of Electronic Materials (JEM). 42, 558-595.
THpub | DOI
2012 | Conference contribution | published
Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors
Jens Göhre, Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang (2012)
Proceedings / CIPS 2012 (pp. k.A.). Berlin ; Offenbach: VDE-Verl.
THpub | URL
2012 | Journal article | published
Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Mohamad Sbeiti, Wolfgang, H. Müller, Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz (2012)
Proceedings in Applied Mathematics and Mechanics (PAMM). 12 (1), 369-370.
THpub | DOI
2011 | Journal article | published
Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang, H. Müller, Herbert Reichl (2011)
Journal of Electronic Materials. 40 (2), 239-246.
THpub | DOI
2011 | Conference contribution | published
Thermo-mechanical description of material diffusion during an ultrasonic wire bonding process
Wolfgang, H. Müller, Mohamad Sbeiti, Martin Schneider-Ramelow, Ute Geißler (2011)
Proceedings in Applied Mathematics and Mechanics (PAMM) : 82nd Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM), Graz 2011 (pp. 427-428).
THpub | DOI
2010 | Book chapter/section | published
Wire Bonding as Dynamic Process of Hardening and Softening
Ute Geißler, Martin Schneider-Ramelow (2010)
In Bernd Michel, Klaus-Dieter Lang, Smart systems integration and reliability. (pp. 422-433). Dresden: Goldenbogen.
THpub
2010 | Journal article | published
Degradation of Heavy Wire Bond Interfaces : Tested on Power Semiconductors during Active Power Cycling
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
Bodo´s Power Systems. 6, 34-36.
THpub | URL
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