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List of Publications (45)

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2012 | Conference contribution | published
Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors
Jens Göhre, Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang (2012)
Proceedings / CIPS 2012 (pp. k.A.). Berlin ; Offenbach: VDE-Verl.
THpub | URL
2012 | Journal article | published
Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Mohamad Sbeiti, Wolfgang, H. Müller, Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz (2012)
Proceedings in Applied Mathematics and Mechanics (PAMM). 12 (1), 369-370.
THpub | DOI
2011 | Journal article | published
Temperatur und Interdiffusion beim Ultraschall-Wedge/Wedge-Bondverschweißen von Aluminiumdrähten auf Ni/Flash-Au
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow (2011)
PLUS : Produktion von Leiterplatten und Systemen. 1, 145-150.
THpub
2011 | Journal article | published
Interface Formation in the US-Wedge/Wedge-Bond-Process of AlSi1/CuNiAu-Contacts
Ute Geißler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang, H. Müller, Herbert Reichl (2011)
Journal of Electronic Materials. 40 (2), 239-246.
THpub | DOI
2011 | Conference contribution | published
Optimierung der Drahteigenschaften für verbesserte Aluminium-Bondkontakte
Ute Geißler, Eugen Milke, Martin Schneider-Ramelow (2011)
Deutsche IMAPS-Konferenz, München (pp. k.A.).
THpub
2011 | Conference contribution | published
Thermo-mechanical description of material diffusion during an ultrasonic wire bonding process
Wolfgang, H. Müller, Mohamad Sbeiti, Martin Schneider-Ramelow, Ute Geißler (2011)
Proceedings in Applied Mathematics and Mechanics (PAMM) : 82nd Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM), Graz 2011 (pp. 427-428).
THpub | DOI
2011 | Journal article | published
Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Teil 2
Martin Schneider-Ramelow, Ute Geißler (2011)
PLUS : Produktion von Leiterplatten und Systemen. 9, 2092-2111.
THpub
2011 | Journal article | published
Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Teil 1
Martin Schneider-Ramelow, Ute Geißler (2011)
PLUS : Produktion von Leiterplatten und Systemen. 11, 1852-1871.
THpub
2010 | Book chapter/section | published
Wire Bonding as Dynamic Process of Hardening and Softening
Ute Geißler, Martin Schneider-Ramelow (2010)
In Bernd Michel, Klaus-Dieter Lang, Smart systems integration and reliability. (pp. 422-433). Dresden: Goldenbogen.
THpub
2010 | Journal article | published
Degradation of Heavy Wire Bond Interfaces : Tested on Power Semiconductors during Active Power Cycling
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
Bodo´s Power Systems. 6, 34-36.
THpub | URL
2010 | Conference contribution | published
Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
Proceedings / PCIM Europe 2010 : International Exhibition & Conference for Power Electronics Intelligent Motion Power Quality (pp. k.A.). Berlin ; Offenbach: VDE-Verl.
THpub
2010 | Conference contribution | published
Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test
Jens Göhre, Martin Schneider-Ramelow, Ute Geißler, Klaus-Dieter Lang (2010)
CIPS 2010 : 6th International Conference on Integrated Power Electronics Systems (pp. 97-102).
THpub | URL
2010 | Conference contribution | published
Thermomechanical Description of Interface Formation in Aluminum Ultrasound (US)-Wedge/Wedge-Wirebond Contacts
Wolfgang, H. Müller, Mohamad Sbeiti, Martin Schneider-Ramelow, Ute Geißler (2010)
2010 12th Electronics Packaging Technology Conference (pp. 473-478).
THpub | URL
2009 | Conference contribution | published
Strukturanalyse mit EBSD in der Mikrosystemtechnik
Ellen Auerswald, Ute Geißler, Bernd Michel (2009)
15. Tagung Festkörperanalytik Chemnitz (pp. k.A.).
THpub
2009 | Conference contribution | published
Mikrostrukturelle Vorgänge der Verschweißung von AlSi1-Draht im Ultraschall-Wedge/Wedge-Bondverfahren
Ute Geißler, Martin Schneider-Ramelow (2009)
Proceedings / Mikrosystemtechnik-Kongress 2009 (pp. P 8.13). Berlin: VDE-Verlag
THpub
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